Method for fabricating microelectronic fabrication electrical test apparatus electrical probe tip having pointed tips

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United States of America Patent

PATENT NO 6909300
APP PUB NO 20030210065A1
SERIAL NO

10143412

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Abstract

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A method for fabricating an electrical test apparatus electrical probe tip first provides a probe tip substrate having a topographic surface. A high density plasma chemical vapor deposition (HDP-CVD) deposited mandrel layer is then formed upon the topographic surface. It has a series of pointed tips formed over a series of topographic features within the topographic surface. Finally, a conductor probe tip layer is formed conformally upon the high density plasma chemical vapor deposition (HDP-CVD) deposited mandrel layer and replicating the series of pointed tips. Due to the series of pointed tips and the series of replicated pointed tips, a microelectronic fabrication when tested with the electrical test apparatus electrical probe tip is tested with enhanced accuracy.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liao, Yu-Ting Hsinchu, TW 4 93
Liu, Fu-Sung Tainan, TW 2 82
Lu, Nai-Cheng Hsinchu, TW 8 79

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