Method for cutting semiconductor wafer protecting sheet
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United States of America Patent
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Jun 28, 2005
Grant Date -
N/A
app pub date -
Jun 5, 2000
filing date -
Jun 11, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
To cut a protecting sheet adhered over the obverse of a wafer, an inclination angle of a cutting tool is adjusted according to a form of a chamfered part of the wafer and a finishing thickness of the wafer so that the protecting sheet is cut into the required minimum size for protecting the obverse of the wafer. Thus, the protecting sheet is not included inside a removed portion in a grinding process of the reverse of the wafer with a grindstone even if the wafer is ground to have extremely thin finishing thickness. Hence, the protecting sheet is not ground while the reverse of the wafer is ground, and the grindstone is thus prevented from being clogged up with ground material of the protecting sheet.
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