Semiconductor device and method of manufacturing same
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United States of America Patent
Stats
-
Jun 28, 2005
Grant Date -
Aug 29, 2002
app pub date -
May 2, 2002
filing date -
Mar 10, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A lead frame has an array of mounting portions connected by joint bars, and each of the mounting portions has an island serving as an external connection terminal and a plurality of lead terminals extending from the island and serving as external connection terminals for a semiconductor chip to be mounted on an adjacent island along the array. An electrically conductive paste is applied to the island, and a semiconductor chip is mounted on the island. Then, the semiconductor chip is electrically connected to the lead terminals by wires. A resin layer is deposited over the semiconductor chip, a principal surface of the island, and principle surfaces the lead terminals, while leaving opposite surfaces of the island and the lead terminals exposed. A region surrounding the island and the lead terminals electrically connected to the island is cut off into a package.
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