Encapsulation for organic electronic devices
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United States of America Patent
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Jun 28, 2005
Grant Date -
Nov 6, 2003
app pub date -
Nov 20, 2002
filing date -
May 2, 2002
priority date (Note) -
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Abstract
An embodiment of the present invention pertains to encapsulating an organic electronic device by selectively depositing a catalyst layer and then exposing the catalyst layer to a monomer to produce a planarization layer. The monomer reacts only in the areas where the catalyst layer is present so there is minimal or no contamination of other areas of the organic electronic device. Selectively depositing the catalyst layer allows the resulting planarization layer to be patterned. A barrier layer is selectively deposited on at least the planarization layer. Another embodiment of the present invention pertains to encapsulating an organic electronic device by depositing a planarization layer on a transfer substrate and then allowing it to stabilize to minimize its reactivity. The planarization layer is transferred from the transfer substrate onto at least an active area of the organic electronic device. A barrier layer is selectively deposited on at least the planarization layer.
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