Multiple contact vertical probe solution enabling Kelvin connection benefits for conductive bump probing
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United States of America Patent
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Jun 28, 2005
Grant Date -
Jul 31, 2003
app pub date -
Jan 25, 2002
filing date -
Jan 25, 2002
priority date (Note) -
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Abstract
Apparatus and methods for testing conductive bumps or target test points on integrated circuits. A multiplicity of probes are extended through a support substrate. At least one of the multiplicity of probe locations include a second electrically isolated probe such that the test point is in contact with two probes. One of the two probes provides a voltage to the test point and the second probe sensing the voltage so as to provide a Kelvin connection.
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