Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods
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United States of America Patent
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Jul 5, 2005
Issued Date -
N/A
app pub date -
Oct 10, 2003
filing date -
Nov 16, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a support substrate, and solder-ball (or other suitable) contact structures disposed on a bottom surface of the support substrate. Composite interconnection elements are described for use as the resilient contact structures disposed atop the support substrate. In use, the support substrate is soldered down onto the circuit board, the contact structures on the bottom surface of the support substrate contacting corresponding contact areas on the circuit board. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate.
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