Substrate processing apparatus and method including a device for applying a coating and a device for measuring the film quality of the coating
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United States of America Patent
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Jul 5, 2005
Grant Date -
Dec 19, 2002
app pub date -
Jun 12, 2002
filing date -
Jun 19, 2001
priority date (Note) -
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Abstract
A substrate processing apparatus is provided with five inspection devices that perform inspections of different kinds to a substrate. Among the five kinds of inspections, the film quality is measured after resist coating, and before post-coating heat-treatment. As the film quality, the amount of solvent remaining in a resist film is measured. The film thickness is measured after heat-treatment following resist coating and before exposure. Meanwhile, the line width and the superposition precision are measured and macroscopic defect inspection is performed after post-development heat-treatment and before the substrate is returned to an indexer.
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