Methods for fabricating semiconductor device test apparatus that include protective structures for intermediate conductive elements
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 5, 2005
Issued Date -
N/A
app pub date -
Mar 25, 2003
filing date -
Jun 8, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for fabricating apparatus for testing semiconductor devices includes forming protective structures for bond wires or other intermediate conductive elements thereof by sequentially fabricating one or more material layers. After a first layer is formed, each subsequent layer is superimposed upon, contiguous with, and mutually adhered to an underlying layer of the protective structure. In addition, a fence member may be assembled with or formed on the test substrate to align and receive a semiconductor device and, thereby, to facilitate assembly of the semiconductor device with the test substrate. The fence member can be formed integrally with the protective structures or secured over the protective structures. Stereolithographic processes may be used to fabricate the fence member.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully