Heat conductive material
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United States of America Patent
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Jul 5, 2005
Grant Date -
Mar 18, 2004
app pub date -
Sep 10, 2001
filing date -
Nov 21, 2000
priority date (Note) -
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Abstract
This invention relates to diamond-containing composite materials that have high thermal conductivity and thermal diffusivity, and to the use of such materials in heat sinks, heat spreading and other heat conductive applications. The material comprises diamond particles silicone carbide and silicon and has a thermal conductivity of at least 400 W/mK and a thermal diffusivity of at least 2.1 cm2/s.
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