Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
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United States of America Patent
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-
Jul 5, 2005
Issued Date -
N/A
app pub date -
Apr 27, 2004
filing date -
Jul 10, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film 10 made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.
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