Multi-barrel die transfer apparatus and method for transferring dies therewith
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United States of America Patent
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Jul 12, 2005
Grant Date -
Feb 5, 2004
app pub date -
Dec 19, 2002
filing date -
Aug 2, 2002
priority date (Note) -
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Abstract
A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. Each hollow barrel of a plurality of hollow barrels is applied to a respective die residing on the first surface. The respective die is caused to move into each hollow barrel in parallel. These steps are repeated until each hollow barrel contains a stack of dies of a predetermined number. A die from each hollow barrel is deposited onto the second surface until the stack of dies contained by each hollow barrel is substantially depleted.
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