Single wafer type substrate cleaning method and apparatus
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United States of America Patent
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Jul 12, 2005
Issued Date -
N/A
app pub date -
May 15, 2003
filing date -
Jun 22, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A single wafer type wet-cleaning apparatus for effectively preventing chemical fluids from flowing to the back face of a wafer when the back face thereof is wet-cleaned by chemical fluids, wherein purified water is injected and supplied to the back face of the wafer while a plurality of chemical fluids is sequentially supplied vertically from above to the wafer, which is rotatably supported, so that the purified water cleans the back face of the wafer and effectively prevents the chemical fluids from flowing to the back face of the wafer.
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