Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 12, 2005
Grant Date -
Dec 4, 2003
app pub date -
Dec 13, 2002
filing date -
May 28, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A chemical mechanical processing apparatus includes a polishing pad capable of polishing a substrate; a stepped retaining having an inner side, a bottom side, and an open region, the open region extending radially outward from the inner side and upward from the bottom side, the open region providing space for pad rebound, the open region further having a plurality of tips to hold a substrate in position during rotation of the substrate against the polishing pad, the stepped retaining ring capable of rotating the substrate against the polishing pad; and a dispenser capable of dispensing a slurry onto the pad.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully