Methods of and device for encapsulation and termination of electronic devices
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United States of America Patent
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Jul 12, 2005
Grant Date -
Feb 12, 2004
app pub date -
Aug 9, 2002
filing date -
Aug 9, 2002
priority date (Note) -
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Abstract
A novel method for production of and an apparatus for an encapsulated solid-state electrochemical device is disclosed. The present invention provides for electrical devices, such as, for example, thin-film batteries with sensitive chemistries that can survive environmental exposure while providing external electrical contact to the internal cell chemistry. The method of packaging of the present invention may include bonding one or more protective multi-layer laminates to the environmentally sensitive surfaces of an electronic device. The present invention may provide the advantage of avoiding entrapped air beneath the laminates.
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