US Patent No: 6,916,856
Number of patents in Portfolio can not be more than 2000
Thermosetting resin compositions containing maleimide and/or vinyl compounds
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Jul 12, 2005
Issued date -
Jul 3, 2002
filing date -
10/187,839
serial no -
In Force
status
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Abstract
In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
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| 4,876,153 Process for the preparation of cyanate resin-based prepregs and films which maintain their tack | 19 | 1988 | |
| 4,908,088 Extreme damage tolerant graphite composites and method of making same | 23 | 1988 | |
| 5,189,116 Extremely tough thermosetting bismaleimide resin systems | 24 | 1989 | |
| 5,314,950 Heat resistant resin composition comprising polymers of N-(substituted) maleimides and improved process for the preparation of said maleimides | 21 | 1993 | |
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| 5,006,673 Fabrication of pad array carriers from a universal interconnect structure | 106 | 1989 | |
| 5,011,066 Enhanced collapse solder interconnection | 32 | 1990 | |
| 5,186,383 Method for forming solder bump interconnections to a solder-plated circuit trace | 63 | 1991 | |
| 5,216,278 Semiconductor device having a pad array carrier package | 519 | 1992 | |
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| 4,806,608 Curable siloxane maleimide composition | 12 | 1987 | |
| 4,886,842 Epoxy-amine compositions employing unsaturated imides | 19 | 1989 | |
| 5,358,992 Die-attach composition comprising polycyanate ester monomer | 41 | 1993 | |
| 5,447,988 Solvent free die-attach compositions | 43 | 1993 | |
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| 4,621,122 High-temperature resistant electrically insulating coating powder | 12 | 1985 | |
| 4,904,360 Water-compatible coating composition | 30 | 1988 | |
| 5,314,513 Abrasive product having a binder comprising a maleimide binder | 27 | 1992 | |
| 5,405,686 Article coated with kured homogeneous thermoset resin/thermoplastic particles | 17 | 1994 | |
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| 4,370,467 Curable resin composition from polyfunctional aromatic ester and maleimide compound | 30 | 1980 | |
| 4,369,302 Curable resin composition comprising cyanate ester and polyisocyanate | 18 | 1980 | |
| 4,740,343 Method for producing rigid resin molds | 20 | 1987 | |
| 5,252,355 Process for producing multilayered printed board | 13 | 1991 | |
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| 4,826,997 N-Substituted arylcyclo butenyl-maleimides | 40 | 1986 | |
| 4,743,642 Color balanced rubber-reinforced plastic | 14 | 1986 | |
| 5,206,321 Polycyanates containing mesogenic moieties as lateral substituents | 6 | 1991 | |
| 5,442,039 Mesogenic polycyanates and thermosets thereof | 14 | 1993 | |
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| 5,183,869 Hardenable compositions | 7 | 1991 | |
| 5,359,020 Hardenable compositions comprising bismaleimides, alkenylphenols and phenol diallyl ethers | 11 | 1991 | |
| 5,470,920 Impregnating solutions based on at least one reactive thermoplastic poly (imide-amide) oligomer and a coreactant, which can be used especially for the production of preimpregnated intermediate articles | 9 | 1993 | |
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| 4,914,814 Process of fabricating a circuit package | 102 | 1989 | |
| 5,527,592 Multilayer article having a planarized outer layer comprising a toughened polycyanurate | 17 | 1994 | |
| 5,599,611 Prepreg and cured laminate fabricated from a toughened polycyanurate | 18 | 1994 | |
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| 4,311,636 Flame-retardant thermoplastic materials and molded parts therefrom | 16 | 1979 | |
| 5,246,784 Ultrathin thermostable bismaleimide films and production thereof | 7 | 1991 | |
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| 5,364,700 Prepregable resin composition and composite | 20 | 1985 | |
| 4,853,449 Bismaleimide formulations containing olefinic ether modifiers | 17 | 1988 | |
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| 4,485,218 Encapsulating composition for inductive devices containing elastomeric polybutadiene having predominate trans-1,4 configuration | 16 | 1982 | |
| 4,578,328 Photopatternable polyimide compositions and method for making | 15 | 1984 | |
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| 4,803,250 Rubber composition with bismaleimides | 22 | 1987 | |
| 4,980,436 Thermosetting resin composition from alkenyl aryloxy triazine compound and poly maleimide | 13 | 1990 | |
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| 5,153,248 Sulfur vulcanized rubber compounds containing silica and aromatic bismaleimide | 17 | 1991 | |
| 5,328,636 Rubber vulcanization system containing bis-(2,5-polythio-1,3,4-thiadiazole), bismaleimide and sulfenamide | 17 | 1993 | |
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| 4,720,445 Copolymers from maleimide and aliphatic vinyl ethers and esters used in positive photoresist | 24 | 1986 | |
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| 4,663,424 Aromatic polyester with dimethylmaleimide end groups | 30 | 1985 | |
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| 4,540,650 Photoresists suitable for forming relief structures of highly heat-resistant polymers | 20 | 1983 | |
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| 4,336,311 Humidity- and salt-resistant electronic component | 20 | 1980 | |
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| 5,017,406 UV curable compositions cured with polysilane and peroxide initiators | 19 | 1988 | |
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| 5,302,661 Continuous products made of thermosettable monomers | 9 | 1991 | |
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| 4,766,179 Bismaleimide compositions | 10 | 1986 | |
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| 4,613,637 Copolymers utilizing isoimides and method of preparing same | 14 | 1983 | |
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| 4,876,358 Oxyethylene bismaleimide derivatives | 17 | 1987 | |
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| 4,826,995 Bismaleimide derivatives of higher molecular weight polyoxyalkyleneamines | 13 | 1987 | |
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| 5,536,970 Resin-encapsulated semiconductor device | 35 | 1994 | |
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| 5,380,768 Foam, Foam-resin composite and method of making a foam-resin composite | 18 | 1993 | |
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| 5,475,048 Conductor-filled thermosetting resin | 31 | 1993 | |
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| 5,137,936 Method for packaging electronic parts and adhesive for use in said method | 31 | 1990 | |
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| 4,323,662 Thermosetting resin compositions comprising bismaleimides and alkenylaniline derivatives | 42 | 1980 | |
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| 4,700,473 Method of making an ultra high density pad array chip carrier | 96 | 1986 | |
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| 4,581,461 Maleated siloxane derivatives | 20 | 1983 | |
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| 4,740,830 Low temperature single step curing polyimide adhesive | 23 | 1987 | |
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| 5,483,101 Multilayer printed circuit board | 26 | 1994 | |
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| 4,533,975 Radiation hardenable coating and electronic components coated therewith | 29 | 1983 | |
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| 4,193,829 Process for the manufacture of low density bis-maleimide-carbon microballoon composites | 21 | 1978 | |
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| 4,564,663 Free radical cure of the bismaleimide of dimer diamine | 7 | 1985 | |
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| 4,847,319 Sealant compositions or coating mixtures containing functional silane or siloxane adhesion promotors nonreactive with blocked isocyanates | 20 | 1988 | |
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| 5,347,258 Annular resistor coupled with printed circuit board through-hole | 94 | 1993 | |
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| 4,873,116 Method of preparing mixtures of incompatible hydrocarbon polymers | 34 | 1986 | |
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| 4,999,136 Ultraviolet curable conductive resin | 61 | 1988 | |
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| H424 Method of synthesizing the bismaleimide of dimer diamine via cyclodehydration | 6 | 1985 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jan 12, 2013 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 12, 2017 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |