Photocurable adhesive compositions, reaction products of which have low halide ion content
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United States of America Patent
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Jul 19, 2005
Grant Date -
Jan 8, 2004
app pub date -
Jun 24, 2002
filing date -
Jun 24, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.
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