Microelectronic component assemblies having exposed contacts
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United States of America Patent
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Jul 26, 2005
Grant Date -
Sep 30, 2004
app pub date -
Mar 18, 2003
filing date -
Mar 18, 2003
priority date (Note) -
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Abstract
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component includes an array of spaced-apart dams, each of which is associated with and circumscribes an open contact volume associated with one of the contacts. A dielectric material may cover the portion of the microelectronic component active surface that is external to the dams and extend between the spaced-apart dams.
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