Reinforced die pad support structure
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United States of America Patent
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Jul 26, 2005
Grant Date -
Mar 24, 2005
app pub date -
Sep 24, 2003
filing date -
Sep 24, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package comprising a die pad defining opposed top and bottom surfaces and a peripheral edge. Attached to the peripheral edge of the die pad is a plurality of support feet which extend downwardly relative to the bottom surface thereof. A plurality of leads extend at least partially about the peripheral edge of the die pad in spaced relation thereto. Attached to the top surface of the die pad is a semiconductor die which is electrically connected to at least one of the leads. A package body encapsulates the die pad, the support feet, the leads and the semiconductor die such that at least portions of the leads are exposed in the package body.
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