Method of forming a structure for supporting an integrated circuit chip
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United States of America Patent
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Aug 2, 2005
Grant Date -
May 2, 2002
app pub date -
Dec 6, 2001
filing date -
Aug 31, 2000
priority date (Note) -
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Abstract
A method and apparatus which provide one or more electromagnetic shield layers for integrated circuit chips containing electromagnetic circuit elements are disclosed. The shield layers may be in contact with the integrated circuit chip, including magnetic memory structures such as MRAMs, or in a flip-chip carrier, or both. A printed circuit board which supports the chip may also have one or more shield layers.
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