Importance

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Abstract

The present disclosure provides probe cards which may be used for testing microelectronic components, including methods of making and using such probe cards. One exemplary implementation provides a probe card that employs a substrate with a plurality of openings. A first probe, which may be used to contact a microelectronic component, includes a first conductor slidably received in one of the openings and a first electrical trace. The electrical trace may be patterned from a metal layer on the back of the substrate and include a resilient free length adapted to urge the first conductor to extend outwardly beyond the front of the substrate. A second probe includes a second conductor slidably received in another one of the openings and a second electrical trace. The second electrical trace may be patterned from a metal layer on the front of the substrate and include a resilient free length adapted to urge the second conductor to extend outwardly beyond the back of the substrate. An electrical pathway through the substrate may electrically couple and first and second electrical traces.

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First Claim