Method of waterproofing power circuit section and power module having power circuit section
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United States of America Patent
Stats
-
Aug 2, 2005
Grant Date -
Jan 8, 2004
app pub date -
Jul 2, 2003
filing date -
Jul 3, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A power module includes a heat radiating member, a power circuit section, a resin layer, and a case. The heat radiating member includes a circuit disposition surface. The power circuit section includes an external connection terminal and is disposed on the circuit disposition surface. The resin layer covers a part of the external connection terminal. The case is attached to the heat radiating member. The external connection terminal stands up from the heat radiating member. The case includes a hood, which has an opening at one end portion thereof. The external connection terminal is inserted into the hood. The resin layer prevents liquid from entering through the hood.
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