Multi-die semiconductor package

United States of America Patent

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Aug 9, 2005
Grant Date
Feb 26, 2004
app pub date
Aug 22, 2002
filing date
Aug 22, 2002

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Abstract

A semiconducting package includes a first capsule, a second capsule and an adhesive within a recess in a surface of the first capsule that secures the first capsule to the second capsule.

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Patent Owner	Address
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT	633 WEST FIFTH STREET 24TH FLOOR LOS ANGELES CA 90071

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Meyers, John G	Sacramento, CA	19	120

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Multi-die semiconductor package

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United States of America Patent

10226070

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PATENT NO	6927497
APP PUB NO	20040036163A1
SERIAL NO	10226070
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 09, 2005	US,6927497,B2 US6927497B2	GRANTED PATENT AS SECOND PUBLICATION
February 26, 2004	US,20040036163,A1 US20040036163A1	FIRST PUBLISHED PATENT APPLICATION

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10226070

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