Temperature compensated vertical pin probing device
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United States of America Patent
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Aug 9, 2005
Issued Date -
N/A
app pub date -
Apr 11, 2003
filing date -
Mar 6, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
An improved vertical pin probing device is constructed with a housing with spaced upper and lower spacers of a metal alloy, each having a thin sheet of silicon nitride ceramic material held in a window in the spacer of adhesive. The spacers may be composed of foils adhered to one another in a laminated structure. The sheets of silicon nitride have laser-drilled matching patterns of holes supporting probe pins and insulating the probe pins from the housing. The spacers and silicon nitride ceramic sheets have coefficients of thermal expansion closely matching that of the silicon chip being probed, so that the probing device compensates for temperature variations over a large range of probing temperatures.
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