Method for fabricating surface acoustic wave filter package
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United States of America Patent
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Aug 16, 2005
Grant Date -
Jan 16, 2003
app pub date -
Apr 11, 2002
filing date -
Dec 7, 2001
priority date (Note) -
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Abstract
A method for fabricating a surface acoustic wave filter chip package includes: mounting a surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the chip; forming a metal shield layer on a whole outer wall of the chip by using a spray process; and molding resins on the metal shield layer. The metal shield layer is formed from a conductive epoxy with the use of a spray nozzle.
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