Semiconductor device and method of manufacturing the same
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United States of America Patent
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Aug 16, 2005
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N/A
app pub date -
Jun 25, 2004
filing date -
Dec 27, 2001
priority date (Note) -
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Abstract
A semiconductor device includes a first substrate including an element, a first plug penetrating through the first substrate, made of a conductive material, and electrically connected with the element, a second substrate provided above the first substrate, and electrically connected with the element via the first plug, and a second plug penetrating through the first substrate, made of a non-dielectric material, and being not electrically connected with the second substrate.
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