Arrangement of integrated circuits in a memory module
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United States of America Patent
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Aug 16, 2005
Issued Date -
N/A
app pub date -
Jan 27, 2004
filing date -
Mar 7, 2002
priority date (Note) -
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Abstract
Integrated circuits utilizing standard commercial packaging are arranged on a printed circuit board to allow the production of 1-Gigabyte and 2-Gigabyte capacity memory modules. A first row of integrated circuits is oriented in an opposite orientation to a second row of integrated circuits. The integrated circuits in a first half of the first row and in the corresponding half of the second row are connected via a signal trace to a first register. The integrated circuits in a second half of the first row and in the corresponding half of the second row are connected to a second register. Each register processes a non-contiguous subset of the bits in each data word.
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