Method of forming a wire package
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United States of America Patent
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Aug 23, 2005
Grant Date -
Jun 24, 2004
app pub date -
Dec 23, 2002
filing date -
Dec 23, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for making a wire package for use as staples or brads is recited as forming a plurality of round wires, forming a plurality of flattened bonding sides on each wire to prepare even bonding surfaces on each wire and bonding each wire to an adjacent wire by adhering the surfaces of each wire. Each staple includes two or more flat surfaces to improve the bonding strength of each staple. A package of diverging staples or brads are formed using the flat bonding surfaces
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