Semiconductor stacked multi-package module having inverted second package and electrically shielded first package
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United States of America Patent
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Aug 23, 2005
Grant Date -
Jul 1, 2004
app pub date -
Oct 8, 2003
filing date -
Oct 8, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor multi-package module has an inverted second package stacked over a first package, in which the stacked packages are electronically interconnected by wire bonds, and in which at least one of the packages is provided with an electrical shield. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die and having a shield, affixing an upper molded package including an upper substrate in inverted orientation onto an upper surface of the lower package, and forming z-interconnects between the upper and lower substrates. Where the shield is situated above the lower package substrate, the inverted upper package is affixed onto an upper surface of the shield.
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