US Patent No: 6,933,617

Number of patents in Portfolio can not be more than 2000

Wafer interposer assembly

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ALSO PUBLISHED AS: 20030148108
ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

A wafer interposer assembly and a system for building the same are disclosed. The wafer interposer assembly includes a semiconductor wafer (10) having a die (11) and a redistribution layer pad (13) electrically connected to the die (11). An epoxy layer (20) is deposited on the surface of the redistribution layer pad (13) and the die (11). An interposer pad (50) is positioned in an opening (40) in the epoxy layer (20) in electrical contact with the redistribution layer pad (13).

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
EAGLESTONE PARTNERS I, LLCDALLAS, TX19
MICRO-ASI, INC.DALLAS, TX19
TRANSPACIFIC MULTICAST, LLCDALLAS, TX19

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pierce, John L Dallas, TX 10 147

Cited Art

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (27)
4,617,730 Method of fabricating a chip interposer 76 1984
4,628,411 Apparatus for directly powering a multi-chip module from a power distribution bus 43 1985
4,688,151 Multilayered interposer board for powering high current chip modules 79 1986
4,998,885 Elastomeric area array interposer 116 1989
5,065,227 Integrated circuit packaging using flexible substrate 87 1990
5,086,558 Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer 60 1990
5,132,613 Low inductance side mount decoupling test structure 52 1990
5,483,421 IC chip attachment 166 1992
5,371,654 Three dimensional high performance interconnection package 215 1992
5,517,515 Multichip module with integrated test circuitry disposed within interposer substrate 52 1994
5,531,022 Method of forming a three dimensional high performance interconnection package 147 1994
5,600,257 Semiconductor wafer test and burn-in 103 1995
5,800,184 High density electrical interconnect apparatus and method 106 1995
5,764,071 Method and system for testing an electronic module mounted on a printed circuit board 26 1996
5,759,047 Flexible circuitized interposer with apertured member and method for making same 74 1996
5,929,651 Semiconductor wafer test and burn-in 43 1996
5,949,246 Test head for applying signals in a burn-in test of an integrated circuit 38 1997
6,137,299 Method and apparatus for testing integrated circuit chips 24 1997
5,764,655 Built in self test with memory 104 1997
5,927,193 Process for via fill 26 1997
5,789,807 On-chip power distribution for improved decoupling 51 1997
5,984,691 Flexible circuitized interposer with apertured member and method for making same 90 1998
5,977,640 Highly integrated chip-on-chip packaging 229 1998
6,258,627 Underfill preform interposer for joining chip to substrate 30 1999
6,101,100 Multi-electronic device package 50 1999
6,319,829 Enhanced interconnection to ceramic substrates 39 1999
6,627,998 Wafer scale thin film package 21 2000
 
TRANSPACIFIC MULTICAST, LLC (12)
6,392,428 Wafer level interposer 17 1999
6,483,043 Chip assembly with integrated power distribution between a wafer interposer and an integrated circuit chip 18 2000
6,537,831 Method for selecting components for a matched set using a multi wafer interposer 16 2000
6,812,048 Method for manufacturing a wafer-interposer assembly 8 2000
6,822,469 Method for testing multiple semiconductor wafers 8 2000
6,483,330 Method for selecting components for a matched set using wafer interposers 17 2000
6,815,712 Method for selecting components for a matched set from a wafer-interposer assembly 12 2000
6,524,885 Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques 30 2000
6,529,022 Wafer testing interposer for a conventional package 24 2000
6,440,771 Method for constructing a wafer interposer by using conductive columns 17 2001
6,825,678 Wafer level interposer 4 2002
6,759,741 Matched set of integrated circuit chips selected from a multi wafer-interposer 5 2003
 
TESSERA, INC. (11)
5,148,266 Semiconductor chip assemblies having interposer and flexible lead 460 1990
5,148,265 Semiconductor chip assemblies with fan-in leads 488 1991
5,347,159 Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate 194 1991
5,518,964 Microelectronic mounting with multiple lead deformation and bonding 324 1994
5,685,885 Wafer-scale techniques for fabrication of semiconductor chip assemblies 95 1994
5,915,752 Method of making connections to a semiconductor chip assembly 55 1995
6,020,220 Compliant semiconductor chip assemblies and methods of making same 81 1996
5,848,467 Methods of making semiconductor chip assemblies 94 1997
5,950,304 Methods of making semiconductor chip assemblies 82 1997
5,885,849 Methods of making microelectronic assemblies 74 1998
6,147,400 Connecting multiple microelectronic elements with lead deformation 30 1998
 
FORMFACTOR, INC. (10)
5,476,211 Method of manufacturing electrical contacts, using a sacrificial member 354 1993
5,900,738 Contact structure device for interconnections, interposer, semiconductor assembly and package using the same and method 146 1996
6,064,213 Wafer-level burn-in and test 252 1997
5,806,181 Contact carriers (tiles) for populating larger substrates with spring contacts 254 1997
5,832,601 Method of making temporary connections between electronic components 188 1997
5,878,486 Method of burning-in semiconductor devices 108 1997
6,032,356 Wafer-level test and burn-in, and semiconductor process 159 1997
6,050,829 Making discrete power connections to a space transformer of a probe card assembly 155 1997
6,246,247 Probe card assembly and kit, and methods of using same 113 1998
6,218,910 High bandwidth passive integrated circuit tester probe card assembly 132 1999
 
FREESCALE SEMICONDUCTOR, INC. (7)
5,399,505 Method and apparatus for performing wafer level testing of integrated circuit dice 102 1993
5,504,369 Apparatus for performing wafer level testing of integrated circuit dice 82 1994
5,594,273 Apparatus for performing wafer-level testing of integrated circuits where test pads lie within integrated circuit die but overly no active circuitry for improved yield 45 1995
5,654,588 Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure 61 1995
5,710,071 Process for underfilling a flip-chip semiconductor device 173 1995
5,714,800 Integrated circuit assembly having a stepped interposer and method 45 1996
5,959,462 Test structure for enabling burn-in testing on an entire semiconductor wafer 38 1997
 
MICRON TECHNOLOGY, INC. (6)
5,570,032 Wafer scale burn-in apparatus and process 91 1993
5,905,382 Universal wafer carrier for wafer level die burn-in 35 1996
5,796,746 Device and method for testing integrated circuit dice in an integrated circuit module 44 1996
6,080,264 Combination of semiconductor interconnect 101 1997
6,313,522 Semiconductor structure having stacked semiconductor devices 110 1998
6,242,932 Interposer for semiconductor components having contact balls 130 1999
 
TEXAS INSTRUMENTS INCORPORATED (6)
5,123,850 Non-destructive burn-in test socket for integrated circuit die 239 1991
6,046,600 Process of testing integrated circuit dies on a wafer 45 1996
5,892,287 Semiconductor device including stacked chips having metal patterned on circuit surface and on edge side of chip 27 1997
6,069,026 Semiconductor device and method of fabrication 15 1997
6,080,494 Method to manufacture ball grid arrays with excellent solder ball adhesion for semiconductor packaging and the array 15 1998
6,432,744 Wafer-scale assembly of chip-size packages 24 1998
 
FUJITSU LIMITED (4)
5,477,160 Module test card 125 1993
5,544,017 Multichip module substrate 51 1994
5,655,290 Method for making a three-dimensional multichip module 46 1995
6,034,332 Power supply distribution structure for integrated circuit chip modules 28 1998
 
LSI LOGIC CORPORATION (4)
5,399,898 Multi-chip semiconductor arrangements using flip chip dies 345 1992
5,347,162 Preformed planar structures employing embedded conductors 59 1993
5,489,804 Flexible preformed planar structures for interposing between a chip and a substrate 179 1993
5,637,920 High contact density ball grid array package for flip-chips 247 1995
 
FAIRCHILD SPACE AND DEFENSE CORPORATION (3)
5,327,325 Three-dimensional integrated circuit package 55 1993
5,491,612 Three-dimensional modular assembly of integrated circuits 142 1995
5,802,713 Circuit board manufacturing method 12 1996
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (3)
5,497,079 Semiconductor testing apparatus, semiconductor testing circuit chip, and probe card 92 1993
6,372,547 Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board 18 1998
6,372,548 Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate 82 1999
 
NEC CORPORATION (3)
5,532,610 Apparatus for testing semicondctor wafer 58 1994
5,805,422 Semiconductor package with flexible board and method of fabricating the same 133 1997
6,053,395 Method of flip-chip bonding between a chip element and a wafer-board 41 1998
 
AMERASIA INTERNATIONAL TECHNOLOGY, INC. (2)
6,376,769 High-density electronic package, and method for making same 206 2000
6,717,819 Solderable flexible adhesive interposer as for an electronic package, and method for making same 20 2000
 
FUJITSU SEMICONDUCTOR LIMITED (2)
5,615,089 BGA semiconductor device including a plurality of semiconductor chips located on upper and lower surfaces of a first substrate 66 1995
6,013,944 Semiconductor device in which chip electrodes are connected to terminals arranged along the periphery of an insulative board 18 1997
 
MOTOROLA, INC. (2)
5,060,052 TAB bonded semiconductor device having off-chip power and ground distribution 24 1990
5,701,666 Method for manufacturing a stimulus wafer for use in a wafer-to-wafer testing system to test integrated circuits located on a product wafer 160 1997
 
ROUND ROCK RESEARCH, LLC (2)
6,083,773 Methods of forming flip chip bumps and related flip chip bump constructions 30 1997
6,161,205 Testing and burn-in of IC chips using radio frequency transmission 44 1998
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (2)
5,834,844 Semiconductor device having an element with circuit pattern thereon 297 1996
6,297,553 Semiconductor device and process for producing the same 25 1999
 
TERADYNE, INC. (2)
5,794,175 Low cost, highly parallel memory tester 81 1997
6,104,202 Interface apparatus for automatic test equipment 25 1997
 
VISTEON GLOBAL TECHNOLOGIES, INC. (2)
6,082,610 Method of forming interconnections on electronic modules 27 1997
6,303,992 Interposer for mounting semiconductor dice on substrates 25 1999
 
AGILENT TECHNOLOGIES, INC. (1)
5,854,507 Multiple chip assembly 143 1998
 
APROLASE DEVELOPMENT CO., LLC (1)
5,635,010 Dry adhesive joining of layers of electronic devices 34 1995
 
AT&T BELL LABORATORIES (1)
4,577,214 Low-inductance power/ground distribution in a package for a semiconductor chip 69 1984
 
ATMEL CORPORATION (1)
6,281,046 Method of forming an integrated circuit package at a wafer level 74 2000
 
CEPROBE CORPORATION, A DE CORP. (1)
5,382,898 High density probe card for testing electrical circuits 100 1992
 
CISCO TECHNOLOGY, INC. (1)
6,154,371 Printed circuit board assembly and method 16 1998
 
DAI NIPPON PRINTING CO., LTD. (1)
6,133,070 Circuit member for semiconductor device, semiconductor device using the same, and method for manufacturing them 28 1998
 
ELAN PHARMACEUTICALS, INC. (1)
5,942,246 Etherlipid containing multiple lipid liposomes 15 1998
 
HEI, INC. (1)
5,936,847 Low profile electronic circuit modules 34 1996
 
HUGHES AIRCRAFT COMPANY (1)
5,600,541 Vertical IC chip stack with discrete chip carriers formed from dielectric tape 93 1995
 
INTEL CORPORATION (1)
6,229,216 Silicon interposer and multi-chip-module (MCM) with through substrate vias 28 1999
 
INVENSAS CORPORATION (1)
6,098,278 Method for forming conductive epoxy flip-chip on chip 47 1997
 
KABUSHIKI KAISHA NIHON MICRONICS (1)
6,275,051 Segmented architecture for wafer test and burn-in 66 1999
 
KABUSHIKI KAISHA TOSHIBA (1)
5,394,303 Semiconductor device 226 1993
 
KULICKE & SOFFA INVESTMENTS, INC. (1)
6,136,681 Tool used in forming a chip scale package 15 1999
 
KULICKE AND SOFFA INDUSTRIES, INC. (1)
5,950,070 Method of forming a chip scale package, and a tool used in forming the chip scale package 98 1997
 
LIN PACKAGING TECHNOLOGIES, LTD. (1)
6,002,178 Multiple chip module configuration to simplify testing process and reuse of known-good chip-size package (CSP) 44 1997
 
LOCKHEED MARTIN CORPORATION (1)
5,384,691 High density interconnect multi-chip modules including embedded distributed power supply elements 57 1993
 
LUCENT TECHNOLOGIES INC. (1)
6,190,940 Flip chip assembly of semiconductor IC chips 44 1999
 
MATRA MARCONI SPACE FRANCE (1)
5,612,575 Method of connecting the output pads on an integrated circuit chip, and multichip module thus obtained 25 1995
 
MICRO TECHNOLOGY, INC. (1)
5,844,803 Method of sorting a group of integrated circuit devices for those devices requiring special testing 80 1997
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
5,309,021 Semiconductor device having particular power distribution interconnection arrangement 20 1992
 
MOSAID TECHNOLOGIES INCORPORATED (1)
5,834,946 Integrated circuit test head 57 1997
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
6,024,275 Method of making flip chip and BGA interconnections 24 1998
 
OKI SEMICONDUCTOR CO., LTD. (1)
5,994,168 Method of manufacturing semiconductor device 10 1998
 
PATENT BUSINESS DEVELOPMENT, LLC (1)
5,838,072 Intrachip power distribution package and method for semiconductors having a supply node electrically interconnected with one or more intermediate nodes 40 1997
 
R-AMTECH INTERNATIONAL, INC. (1)
5,943,213 Three-dimensional electronic module 35 1998
 
RAYTHEON COMPANY (1)
5,579,207 Three-dimensional integrated circuit stacking 116 1994
 
RPX CORPORATION (1)
6,018,462 Multi-tip module 16 1998
 
SEMICOA CORPORATION (1)
5,798,652 Method of batch testing surface mount devices using a substrate edge connector 77 1996
 
SKYWORKS SOLUTIONS, INC. (1)
6,331,782 Method and apparatus for wireless testing of integrated circuits 38 1998
 
THIN FILM MODULE, INC. (1)
6,242,279 High density wire bond BGA 64 1999
 
TOKYO ELECTRON LIMITED (1)
5,410,259 Probing device setting a probe card parallel 135 1993
 
UNISYS CORPORATION (1)
6,049,467 Stackable high density RAM modules 58 1998
 
Other [Check patent profile for assignment information] (5)
4,868,712 Three dimensional integrated circuit package 194 1987
5,016,138 Three dimensional integrated circuit package 295 1989
5,532,612 Methods and apparatus for test and burn-in of integrated circuit devices 122 1994
5,838,060 Stacked assemblies of semiconductor packages containing programmable interconnect 41 1995
5,897,326 Method of exercising semiconductor devices 67 1997

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
7,245,011 Prevention of contamination on bonding pads of wafer during SMT 4 2004
 
INTEL CORPORATION (1)
8,399,291 Underfill device and method 0 2005

Maintenance Fees

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7.5 Year Payment $3600.00 $1800.00 $900.00 Feb 23, 2013
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