Method and apparatus for designing a pattern on a semiconductor surface

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United States of America Patent

PATENT NO 6934928
APP PUB NO 20040044980A1
SERIAL NO

10229330

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of forming a pattern of elements is shown. In one embodiment, the method is used to create a reticle. In another embodiment, the method is used to further form a number of elements on a surface of a semiconductor wafer. Identified problem structures or regions in a pattern of elements are moved from lower level cells of a hierarchy structure into higher level cells before edge movement takes place. Because all cells have been selectively leveled first, substantially all external influences to cells have been removed for each cell before edge movement takes place. The methods and procedures described herein therefore reduce the possibility of undesirable modifications such as electrical shorts. The methods and procedures described herein also reduce overall processing time.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Juengling, Werner Boise, ID 253 4600

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