Method of forming electrical connection for fluid ejection device
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United States of America Patent
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Aug 30, 2005
Issued Date -
N/A
app pub date -
Dec 12, 2002
filing date -
Mar 8, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of forming an electrical connection for a fluid ejection device including a fluid channel communicating with a first side and a second side of the fluid ejection device and an array of drop ejecting elements formed on the first side of the fluid ejection device includes forming a trench in the second side of the fluid ejection device, depositing a conductive material in the trench, forming a first opening in the fluid ejection device between the first side of the fluid ejection device and the conductive material in the trench, depositing a conductive material in the first opening, and forming a conductive path between the conductive material in the first opening and a wiring line of one of the drop ejecting elements.
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