Metal/ceramic bonding article and method for producing same
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United States of America Patent
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Aug 30, 2005
Grant Date -
Apr 3, 2003
app pub date -
Sep 25, 2002
filing date -
Oct 1, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: arranging a metal plate 12 of an overall-rate solid solution type alloy on a ceramic substrate 10; and heating the metal plate 12 and the ceramic substrate 10 in a non-oxidizing atmosphere at a temperature of lower than a melting point of the alloy to bond the metal plate 12 directly to the ceramic substrate 10. According to this method, it is possible to easily bond an alloy plate directly to a ceramic substrate, and it is possible to inexpensively provide an electronic member for resistance without causing the alloy plate to be deteriorated.
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