Encapsulation of organic electronic devices using adsorbent loaded adhesives
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United States of America Patent
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Aug 30, 2005
Grant Date -
Jul 31, 2003
app pub date -
Jan 31, 2002
filing date -
Jan 31, 2002
priority date (Note) -
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Abstract
Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or may cover the entire device and its periphery. An encapsulating lid covers the device.
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