Thin-film electronic device module
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United States of America Patent
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Aug 30, 2005
Grant Date -
Sep 2, 2004
app pub date -
Feb 28, 2003
filing date -
Feb 28, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
In an embodiment of this invention, an encapsulated electronic thin-film device includes a substrate and an active area is fabricated on the substrate. The active area is comprised of at least one electronic thin-film element. A thin-film encapsulation layer is selectively deposited on at least the active area to cover at least the active area. Traces protrude slightly past a perimeter of the thin-film encapsulation layer. The traces are routed to two or more contact pads to which one or more connectors can attach. Attaching the connector to the contact pads allows an external device to be coupled to the active area of the electronic thin-film device.
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