Probe card assembly for contacting a device with raised contact elements
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United States of America Patent
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-
Aug 30, 2005
Issued Date -
N/A
app pub date -
Jul 16, 2002
filing date -
Nov 9, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A probe card is provided for probing a semiconductor wafer with raised contact elements. In particular, the present invention is useful with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact elements on the wafer. In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer is prepared with contact posts on one side and terminals on the opposing side. An interposer with spring contacts connects a contact on the opposing side of the space transformer to a corresponding terminal on a probe card, which terminal is in turn connected to a terminal which is connectable to a test device such as a conventional tester.
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