Tip and tip assembly for a signal probe

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United States of America Patent

PATENT NO 6937039
APP PUB NO 20040239348A1
SERIAL NO

10447693

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A signal probe includes a tip assembly having a first tip for contacting a first signal node, a second tip for contacting a second signal node, and a tip body for positioning the first tip a distance away from the second tip, the distance corresponding to the spacing between the first and second signal nodes. With the tip body, a technician no longer has to couple a wire between one of the signal nodes and a respective tip to probe the electronic device. Thus, the length of the path that a signal travels from the first signal node to the second signal node may be reduced to increase the accuracy of the signal's measurement.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barr, Andrew Harvey Roseville, CA 59 866
Logan, Gary Orangevale, CA 1 26

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