Automated wafer defect inspection system and a process of performing such inspection
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United States of America Patent
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Aug 30, 2005
Grant Date -
N/A
app pub date -
Apr 29, 2000
filing date -
Jul 15, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
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