Methods of manufacturing board having throughholes filled with resin and multi-layered printed wiring board using the board
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United States of America Patent
Stats
-
Sep 6, 2005
Grant Date -
Apr 24, 2003
app pub date -
Oct 18, 2002
filing date -
Oct 22, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A resin filled board is manufactured by forming roughened surfaces on a conductive layer in a throughhole before it is filled with a resin, forming smooth surfaces on conductive layers on the top and bottom of the board, printing the resin using a mask having an opening at a position corresponding to the throughhole to selectively fill the resin in the throughhole, and curing the resin. In this way, the surface of the conductive layer around the throughhole is smoothed, so that hardly any of the resin remains on the surfaces near the throughhole when the surfaces of the board is mechanically polished after the resin is cured. Also, the filling resin will not fall down into the throughhole.
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- Non-US Classification not provided for expired patents
Cited Art Landscape
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