Flexible compliant interconnect assembly
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United States of America Patent
Stats
-
Sep 6, 2005
Grant Date -
Jan 2, 2003
app pub date -
Jan 11, 2001
filing date -
Jan 20, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method and apparatus for achieving a fine pitch interconnect between a flexible circuit member and another circuit member with co-planar electrical contacts that have a large range of compliance. The interconnect assembly includes a substrate with one or more compliant raised portions. At least one flexible circuit member having a first surface with a plurality of contact pads and a second surface is provided. The substrate is located along the second surface of the flexible circuit member with the compliant raised portions aligned with the contact pads so that the compliant raised portions bias the contact pads with corresponding contact pads on the first circuit member when in a compressive relationship.
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