Method of transferring a device, a method of producing a device holding substrate, and a device holding substrate

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United States of America Patent

PATENT NO 6939729
APP PUB NO 20020115265A1
SERIAL NO

10024690

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Abstract

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The interface between a first substrate and light-emitting diodes formed on the first substrate is selectively irradiated with an energy beam and transmits the energy beam through the first substrate, thereby selectively releasing the light-emitting diodes. The light-emitting diodes are then transferred onto a device holding layer included on a device holding substrate. Subsequently, the light-emitting diodes are transferred onto a second substrate. The irradiation of the interface with the energy beam enables the devices to be easily released from the first substrate.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATIONTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwafuchi, Toshiaki Kanagawa, JP 70 2096
Oohata, Toyoharu Kanagawa, JP 98 4084
Yanagisawa, Yoshiyuki Kanagawa, JP 62 810

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