Use of palladium in IC manufacturing with conductive polymer bump
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 6, 2005
Grant Date -
Oct 23, 2003
app pub date -
May 5, 2003
filing date -
May 21, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a two-stage epoxy, on the palladium plated contact point, are provided. The present invention also relates to assemblies comprising one or more of these substrates.
First Claim
Family
International Classification(s)
- Non-US Classification not provided for expired patents
Cited Art Landscape
Patent Citation Ranking
- Citation Ranking not provided for expired patents
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully