Assemblies having stacked semiconductor chips and methods of making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 6, 2005
Grant Date -
Dec 2, 2004
app pub date -
May 30, 2003
filing date -
May 30, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse surface for mounting to an external circuit. The first panel includes a non-overmolded microelectronic element mounted thereon. The microelectronic element having a rear face and a front face surface, wherein the front face surface confronts the obverse surface of the first panel. During manufacture the flexible sheet is folded to create a stacked microelectronic assembly such that the rear face of the first microelectronic assembly confronts and substantially contacts the obverse surface of the second panel. This results in the second panel being kept substantially flat during subsequent mounting to the external circuit.
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