Method for producing printed wiring board
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United States of America Patent
Stats
-
Sep 13, 2005
Grant Date -
Jun 26, 2003
app pub date -
Feb 12, 2003
filing date -
Mar 6, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for making a printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate 2, comprised of a core material 11 at least one side of which carries a land 23, and flexible substrates 3, 4, 5, and 6 comprised of core materials 33, 36 on at least one surface of which a bump 32 for electrical connection to the land 38 is formed protuberantly. The rigid substrate 2 and the flexible substrates 3 to 6 are molded as one with each other, with the interposition of an adhesive in-between, so that the land and the bump face each other.
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Cited Art Landscape
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