Noncontact IC card
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 13, 2005
Grant Date -
Apr 3, 2003
app pub date -
Nov 22, 2001
filing date -
Nov 30, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In an IC card, an IC module constructed by mounting an IC chip and an antenna circuit on a substrate is sandwiched between at least a pair of exterior films. The IC chip is sealed with resin on its outside and reinforced by a reinforcement material having a substantially circular shape with a diameter greater than a longest dimension value of the IC chip. The height variation amount of the shape of the reinforcement material on a surface thereof is within a range of 20 μm or less. The reliability of the IC chip is ensured while the outer appearance of the card and print characteristic are not degraded.
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