Packaged microelectronic devices and methods of forming same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 13, 2005
Grant Date -
Feb 3, 2005
app pub date -
Aug 30, 2004
filing date -
Aug 29, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
Microelectronic devices in accordance with aspects of the invention may include a die, a plurality of lead fingers and an encapsulant which may bond the lead fingers and the die. In one method of the invention, a lead frame and a die are releasably attached to a support, an encapsulant is applied, and the support can be removed to expose back contacts of the lead fingers and a back surface of the die. One microelectronic device assembly of the invention includes a die having an exposed back die surface; a plurality of electrical leads, each of which includes front and back electrical contacts; bonding wires electrically coupling the die to the electrical leads; and an encapsulant bonded to the die and the electrical leads. The rear electrical contacts of the electrical leads may be exposed adjacent a back surface of the encapsulant in a staggered array.
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