Method for attaching a porous metal layer to a metal substrate
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United States of America Patent
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Sep 20, 2005
Grant Date -
Dec 18, 2003
app pub date -
Jun 6, 2003
filing date -
Jun 18, 2002
priority date (Note) -
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Abstract
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components or acetabular cups. The method, in one embodiment thereof, comprises providing a structured porous layer; providing a dense metal substrate; providing a binding mixture; applying the binding mixture to the exterior of the substrate; placing the porous layer against the substrate such that the binding mixture is disposed there between forming an assembly; and heat treating the assembly to metallurgically bond the porous layer to the substrate.
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