Fluid pressure bonding
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United States of America Patent
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Sep 20, 2005
Issued Date -
N/A
app pub date -
Jun 4, 2002
filing date -
Jul 18, 2000
priority date (Note) -
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Abstract
An improved method of bonding involves using direct fluid pressure to press together the layers to be bonded. Advantageously one or more of the layers are sufficiently flexible to provide wide area contact under the fluid pressure. Fluid pressing can be accomplished by sealing an assembly of layers to be bonded and disposing the assembly in a pressurized chamber. It can also be accomplished by subjecting the assembly to jets of pressurized fluid. The result of this fluid pressing is reduction of voids and enhanced uniformity over an enlarged area.
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