Ball grid array package having testing capability after mounting
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United States of America Patent
Stats
-
Sep 20, 2005
Grant Date -
Feb 17, 2005
app pub date -
Aug 13, 2003
filing date -
Aug 13, 2003
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A ball grid array package that can be readily tested before or after mounting to a printed circuit board. The ball grid array includes a substrate having a top surface and a bottom surface. Several conductive pads are located on the top surface. Several passive circuit elements are located on the top surface between the conductive pads. An insulative coating is placed on top of the passive circuit elements and the substrate. The insulative coating has openings over the conductive pads. The openings are adapted to be accessible by an electrical probe. Conductive vias extend through the substrate between the top and bottom surfaces. The vias electrically connect with the conductive pad on the top surface. Several conductive balls are located on the bottom surface. Each conductive ball is electrically connected to one of the vias.
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