Probe structures using clamped substrates with compliant interconnectors
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United States of America Patent
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Sep 20, 2005
Issued Date -
N/A
app pub date -
Apr 16, 2003
filing date -
Mar 12, 2003
priority date (Note) -
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Abstract
One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a substrate having contactors on a first side and pads on a second side; (b) a card having pads on a first side; and (c) interconnectors that electrically connect the pads on the second side of the substrate with the pads on the card; wherein at least one of the interconnectors includes at least a portion that does not melt at temperatures in a range from about 183° C. to about 230° C., and the distance between the substrate and the card is determined by a dimension of the at least a portion.
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