Method for measuring product parameters of components formed on a wafer and device for performing the method
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United States of America Patent
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Sep 20, 2005
Grant Date -
Nov 14, 2002
app pub date -
Feb 19, 2002
filing date -
Feb 19, 2001
priority date (Note) -
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Abstract
A measuring arrangement for measuring product parameters of a component in the epitaxial layer (28) of a wafer comprises measuring probe (3) on whose contact side (23) a recess (24) is installed, into which an electrolyte can be poured. The electrolyte produces an electrical connection between a contact body (11), which is charged with a signal from a pulsed-current source, and the surface (22) of the wafer (2). A detector (16) serves for detecting the light which is emitted by the component.
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